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FATC to expand capacity for DDR4 burn-in, testing
Acknowledging robust demand for datacenter and servers, backend firm Formosa Advanced Technologies (FATC) will expand production capacity for DDR4 burn-in and testing, according to the company......»»
Tight IC backend service capacity to ease after Lunar New Year holiday
Taiwan-based IC suppliers expect the current tight capacity at IC backend service firms to ease right after the Lunar New Year holidays, benefiting their business developments from the second quarter and beyond......»»
Backend firms upbeat about demand for MediaTek chips
Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up capacity support for the chipmaker, according to industry sources......»»
III-V IC players enjoy high capacity utilization for 5G, Wi-Fi 6 applications
Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photo.....»»
PS5 shipments to reach 16.8-18 million units in 2021
Production for Sony's PS5 game consoles is likely to reach 16.8-18 million units in 2021, fueled by additional capacity support from TSMC and backend services firms, according to industry sources......»»
Lextar, Epistar, AOT eyeing mini LED backlighting for 8K TVs
LED firms Lextar Electronics, Epistar and Advanced Optoelectronic Technology (AOT) are readying capacity for mini LED backlighting applications for 8K LCD TVs, according to industry sources......»»
Highlights of the day: TSMC keen on packaging technology
TSMC is unqestionably the global leader in the pure-play foundry, but it is also gearing up efforts expanding its presence in the backend sector. Its advanced wafer-level packaging capacity is set to enjoy rising utilization in second-quarte.....»»
TSMC advanced packaging capacity utilization to climb
Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second quarter of 2020, according to sources at dedicated OSAT companies......»»
Outbreak posing mixed impacts on different semiconductor segments in China
The coronavirus outbreak has posed mixed impacts on semiconductor firms operating in China, with backend service houses suffering the most, reaching average capacity utilization of only 50% due to labor shortages, according to industry sources......»»
Taiwan IC backend houses to expand production capacity
Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according to industry sources......»»
Taiwan backend firms to up capacity for OLED driver ICs in 1H20
Taiwan-based display driver IC designers and backend specialists are looking to ready additional capacities by mid-2020 to meet growing demand for OLED driver ICs, according to industry sources......»»
Taiwan backend firms expanding testing capacities for 5G chipsets
Taiwan's backend specialists ASE Technology, Powert.....»»
PTI to invest US$200 million to expand high-end testing capacity
Backend house Powertech Technology (PTI) plans to invest up to US$200 million to expand production capacity for high-end logic chips at its Suzhou (China) plant, according to market sources......»»
ASE to buy new factory building to optimize capacity deployment
Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to pu.....»»
IC backend firms expanding capacities on strong demand from Huawei
Taiwan IC backend service firms are moving to carry out capacity expansions to meet increased ship.....»»
China IC packager Tongfu sets up new fab in Xiamen
As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation bases to offer multiple fo.....»»
Driver IC backend firms ink 3-year supply contracts
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three years, according to industry sources......»»
MPI seeing probe card demand pick up
MJC Probe (MPI) has seen probe card demand for semiconductor wafer testing pick up thanks to growing demand for the production of TDDI chips and backend houses' capacity expansions, according to company spokesperson Amanda Chiu......»»
SPIL building new plant at CTSP as main high-end backend base
Siliconware Precision Industries (SPIL) is building a new plant at the Central Taiwan Science Park (CTSP), which will become its main high-end packaging and testing base for the next 8-10 years, according to the company......»»