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FATC to expand capacity for DDR4 burn-in, testing

Acknowledging robust demand for datacenter and servers, backend firm Formosa Advanced Technologies (FATC) will expand production capacity for DDR4 burn-in and testing, according to the company......»»

Category: topSource: digitimesMay 31st, 2018

Tight IC backend service capacity to ease after Lunar New Year holiday

Taiwan-based IC suppliers expect the current tight capacity at IC backend service firms to ease right after the Lunar New Year holidays, benefiting their business developments from the second quarter and beyond......»»

Category: topSource: digitimesFeb 12th, 2021

Backend firms upbeat about demand for MediaTek chips

Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up capacity support for the chipmaker, according to industry sources......»»

Category: topSource: digitimesJan 28th, 2021

III-V IC players enjoy high capacity utilization for 5G, Wi-Fi 6 applications

Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photo.....»»

Category: topSource: digitimesJan 14th, 2021

PS5 shipments to reach 16.8-18 million units in 2021

Production for Sony's PS5 game consoles is likely to reach 16.8-18 million units in 2021, fueled by additional capacity support from TSMC and backend services firms, according to industry sources......»»

Category: topSource: digitimesDec 29th, 2020

Lextar, Epistar, AOT eyeing mini LED backlighting for 8K TVs

LED firms Lextar Electronics, Epistar and Advanced Optoelectronic Technology (AOT) are readying capacity for mini LED backlighting applications for 8K LCD TVs, according to industry sources......»»

Category: topSource: digitimesMar 20th, 2020

Highlights of the day: TSMC keen on packaging technology

TSMC is unqestionably the global leader in the pure-play foundry, but it is also gearing up efforts expanding its presence in the backend sector. Its advanced wafer-level packaging capacity is set to enjoy rising utilization in second-quarte.....»»

Category: topSource: digitimesMar 4th, 2020

TSMC advanced packaging capacity utilization to climb

Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second quarter of 2020, according to sources at dedicated OSAT companies......»»

Category: topSource: digitimesMar 3rd, 2020

Outbreak posing mixed impacts on different semiconductor segments in China

The coronavirus outbreak has posed mixed impacts on semiconductor firms operating in China, with backend service houses suffering the most, reaching average capacity utilization of only 50% due to labor shortages, according to industry sources......»»

Category: topSource: digitimesFeb 12th, 2020

Taiwan IC backend houses to expand production capacity

Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according to industry sources......»»

Category: topSource: digitimesJan 22nd, 2020

Taiwan backend firms to up capacity for OLED driver ICs in 1H20

Taiwan-based display driver IC designers and backend specialists are looking to ready additional capacities by mid-2020 to meet growing demand for OLED driver ICs, according to industry sources......»»

Category: topSource: digitimesJan 10th, 2020

Taiwan backend firms expanding testing capacities for 5G chipsets

Taiwan's backend specialists ASE Technology, Powert.....»»

Category: topSource: digitimesNov 6th, 2019

PTI to invest US$200 million to expand high-end testing capacity

Backend house Powertech Technology (PTI) plans to invest up to US$200 million to expand production capacity for high-end logic chips at its Suzhou (China) plant, according to market sources......»»

Category: topSource: digitimesSep 25th, 2019

ASE to buy new factory building to optimize capacity deployment

Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to pu.....»»

Category: topSource: digitimesAug 13th, 2019

IC backend firms expanding capacities on strong demand from Huawei

Taiwan IC backend service firms are moving to carry out capacity expansions to meet increased ship.....»»

Category: topSource: digitimesJul 25th, 2019

Backend firm PTI to expand production capacity for advanced packaging

Powe.....»»

Category: topSource: digitimesJul 25th, 2018

China IC packager Tongfu sets up new fab in Xiamen

As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation bases to offer multiple fo.....»»

Category: topSource: digitimesJul 27th, 2018

Driver IC backend firms ink 3-year supply contracts

Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three years, according to industry sources......»»

Category: topSource: digitimesAug 22nd, 2018

MPI seeing probe card demand pick up

MJC Probe (MPI) has seen probe card demand for semiconductor wafer testing pick up thanks to growing demand for the production of TDDI chips and backend houses' capacity expansions, according to company spokesperson Amanda Chiu......»»

Category: topSource: digitimesAug 29th, 2018

SPIL building new plant at CTSP as main high-end backend base

Siliconware Precision Industries (SPIL) is building a new plant at the Central Taiwan Science Park (CTSP), which will become its main high-end packaging and testing base for the next 8-10 years, according to the company......»»

Category: topSource: digitimesMay 20th, 2021