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Taiwan backend houses see more demand for consumer power chips

Taiwan-based power IC backend specialists including Greatek Electronics, GEM Services and Lingsen Precision Industries have seen a ramp-up in packaging demand for consumer devices from international IDMs, according to industry sources......»»

Category: topSource: digitimesDec 16th, 2020

China, Taiwan makers step up development of UV-C LED devices

China- and Taiwan-based LED makers have stepped up development of UV-C LED devices for disinfection purposes in the wake of the coronavirus pandemic, according to industry sources......»»

Category: topSource: digitimesApr 28th, 2020

Tainergy to produce SiC wafers

Solar cell maker Tainergy Tech will step into production of silicon carbide (SiC) wafers for making high-voltage power devices, according to company chairman Frank Hsieh......»»

Category: topSource: digitimesFeb 20th, 2020

Optical devices makers asked to step up shipments for China 5G base stations

The locakdown of Wuhan, the epicenter of coronavirus outbreak and China's production hub for optical communications components, may dent the construction of.....»»

Category: topSource: digitimesFeb 3rd, 2020

ASE, IDMs teaming up to deepen deployments in auto IC modules

Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its deployment in auto-use IC components packaging, having teamed up with m.....»»

Category: topSource: digitimesJan 20th, 2020

China, Taiwan chipmakers step up deployments in automotive NOR flash

China's GigaDevice, and Taiwan-based Winbond Electronics and Macronix International have been aggressively expanding their automotive NOR flash offerings eyeing a bigger share in the high-end market segment, according to industry sources......»»

Category: topSource: digitimesDec 4th, 2019

MarketWatch First Take: Intel, AMD and Nvidia step up their fight for AI chips in the high-performance arena

Three rival chip giants, Advanced Micro Devices Inc., Intel Corp. and Nvidia Corp., all rolled out new products at the annual supercomputing conference, in an increasingly competitive battlefield to speed up the fastest computers on earth......»»

Category: topSource: marketwatchNov 18th, 2019

Heat-sink solution providers to brace for strong sales along with 5G deployments

The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond, according to industry sources......»»

Category: topSource: digitimesSep 16th, 2019

FDA, CDC Step Up Investigations Into Vaping

Following more than 200 reports of respiratory illness and one death possibly linked to using e-cigarettes, the U.S. FDA and CDC are stepping up their investigation into the use of the devices and........»»

Category: blogSource: 247wallstSep 3rd, 2019

China sees Taiwan supply chain as alternative to IDMs for power IC devices

China ICT makers are keen on turning to Ta.....»»

Category: topSource: digitimesJun 19th, 2019

IDMs revving up production of GaN, SiC devices for 5G applications

High-performance RF components and power devices made of third-generation compound semiconductor materials with wide band-gap, such as GaN and SiC, are exp.....»»

Category: topSource: digitimesMar 11th, 2019

IDMs, Taiwan IC firms gearing up to develop car-use SiC power devices

With silicon carbide (.....»»

Category: topSource: digitimesApr 23rd, 2018

MOSFET shortage easing

The supply of MOSFET chips has become sufficient in the second quarter as international IDMs have moved to scale up their output for entry-level and mid-range devices, according to industry sources in Taiwan......»»

Category: topSource: digitimesMay 18th, 2018

What California"s new IoT privacy law means for Bay Area tech companies

California is poised to become the first state to pass a landmark cybersecurity bill regulating internet-connected devices. While the bill is a step in the right direction, experts said, businesses are concerned the law is too vague. SB 327, which p.....»»

Category: topSource: bizjournalsSep 21st, 2018

IDMs keen to develop advanced power devices with SiC, GaN

International IDMs including STMicrolectronics, Infineon and TI are aggressively developing power device.....»»

Category: topSource: digitimesOct 1st, 2018

IDMs keen to develop GaN devices for new application markets

Leading international IDMs including Texas Instruments (TI), Infineon and Rohm are aggressi.....»»

Category: topSource: digitimesNov 2nd, 2018

Backend specialists moving to tap booming demand for automotive chips

International IDMs have turned conservative about outsourcing packaging services for ICs needed to power mobile communication and consumer electronics devices, undermining Taiwan backend service pr.....»»

Category: topSource: digitimesNov 5th, 2018

Ericsson offers WNC-made 5G devices for customer trials

Ericsson has taken a step to drive 5G commercial readiness by contracting Wistron NeWeb Corporation (WNC) to deliver 5G mobile devices for use in customer trials from the fourth quarter of 2018......»»

Category: topSource: digitimesNov 5th, 2018

This Man Kept Losing His iPhone Each Year To Make Money

iPhones are super premium devices, and there is no dearth of frauds or tricks that people do to get this coveted handset. One Malaysian man, however, went a step further to use his purchased iPhone to t.....»»

Category: blogSource: valuewalkNov 29th, 2018

USB Type-C chip prices to fall over 20% in 2019

USB Type-C interface devices are increasingly applied to a variety of consumer electronics gadgets, prompting major Taiwan IC design houses to deepen their deployments in related chip solutions. But prices of such chips are l.....»»

Category: topSource: digitimesDec 19th, 2018